In 2000 we finished the technology to manufacture very wide range of flexible printed circuits.
In 2003 we started to produce two layers flexible printed circuits.
Since 2004 we have been developing the technology of manufacturing flexible printed circuits according to different customers demand.
The carrier we use for flexible printed circuits are polyimide or polyester.
The most popular thicknesses in case of polyimide are 25 and 50 micron, in case of polyester these are 50 and 125 micron.
The thickness of copper layer is 18 and 35 micron.
The manufacturing technology is similar to traditional rigid PCB.
The most important thing is to avoid the covering the total layout by surface finish hot air levelling, tin, tin-lead or hard gold plating. It is because these treatments are too thick to cover a flexible circuit. The FPC would loose its flexibility. Of course at the part of the layout wher soldering is planned we can use hard gold.
We have possibility for the creating of the circuit, we can fix the components by soldering. In case of PET material, which can bear less heat we need to place smaller soldering areas (IC, resistor... etc.), we should use the components, which need smaller soldering space and shorter soldering time. Otherwise the foil can crush.
The mechanical finish can happen by cutting, laser cutting, routing or punching.
We use this type of flexible printed circuit when we prepare foil tastature, membrane switch.
Heat resistant foil, on which we apply the conductive ink by screen printing. After we cure it at the adequate temperature.
Circuits, on which we can fix the components by conductive-adhesive ink.